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Silicone Encapsulant V205 |
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Silicone Encapsulant V205 is a low viscosity, dual component, thermally accelerable potting compound for the electronics industry. * Low viscosity * Excellent adhesion * Thermally accelerable cure * Flame retardant, UL 94V-0 V205 works best when cured at 100'C or more for 15 minutes depending on the size and heat sink properties of the casting. V205 contains no solvents and does not liberate any by-products during vulcanization. V205 adheres very well to a variety of substrates. Substrates should be clean to attain optimum adhesion. Primers are available to solve special adhesion problems. |
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Appearance : Black Density, g/ml : 1.26 Viscosity, cps : 2000 Pot Life, at 25'C : >2 hours , at 40'C : >50 minutes |
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