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| Dynasolve CU-9 |
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| Cyclic Amide |
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Dynasolve CU-9 is a high flash point proprietary solvent system designed to remove both uncured and cured silicone release agents from metal molds.
Dynasolve CU-9 is very effective in the polyurethane molding industry and the baking industry.
Dynasolve CU-9 also dissolves RTV silicones and polyamide-based adhesives.
The product is a non-chlorinated, nonflammable, non-carcinogenic, non-ozone depleting solvent designed to replace solvents such as methylene chloride and 1,1,1-trichloroethane in cleaning silicone mold release build-up.
Dynasolve CU-9 is much safer than the above mentioned chlorinated solvents and friendlier to the environment.
It can be used for extended periods, tolerates a high resin loading and will reduce disposal costs.
In addition, Dynasolve CU-9 is recyclable using vacuum distillation. |
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Color: water white to slight amber
Specific Gravity: 0.98
Boiling Point: >400'F
Flash Point: 264'F |
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