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| Dynastrip 500 |
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Dynastrip 500 is formulated for the quick and easy removal of temporary bonding adhesives used on optics, thin film heads, wafers and other substrates during various semiconductor or magnetic head manufacturing operations.
This new product was developed as an effective replacement for solvents like dioctyl phthalates and other plasticizers.
It is a low-toxicity, non-chlorinated solvent with no SARA 313 reportables, and contains less than 25% VOCs.
Dynastrip 500 will not attack semiconductor substrates or carrier device substrates such as ceramic, acrylic, polycarbonate, and most metals including aluminum.
*Applications:
- Generally, removal of bonding adhesives used during dicing, grinding, lapping, and polishing.
- Specifically, removal of adhesive from slice fixtures, bond bars, and carriers used for lapping purposes in disk drive manufacturing.
- Specifically, removal of adhesive from substrates used in dicing polished thin film substrates used in the manufacturing of surface mount chip resistors. |
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Physical Form: Clear Liquid
Odor & Appearance: Pale yellow w/very mild odor
Specific gravity: 0.95-0.99
Flash point: >150'C |
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