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| Dynasolve FS8230 |
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Dynasolve FS8230 is a water-dilutable defluxer formulated to replace highly alkaline products.
It is designed to remove flux residues from wafer bumps found in microelectronic packaging.
It is effective at removing flux while simultaneously leaving the solder bumps and any exposed copper a bright finish with no etching.
It is also effective in the removal of a variety of repeatedly baked-on flux residues from fixtures.
Dynasolve FS8230 can be used in most in-line and batch aqueous and semi-aqueous equipment including ultrasonics.
*Application: through-hole, surface mount, post-reflow or wave-solder, flip chip/ BGA packaging |
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Appearance: clear to light amber liquid
pH, neat: 9-10
Specific gravity: 1.00
Viscosity: water thin |
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