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| Hipec Q3-6646 |
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2-part clear heat cure gel, very low viscosity, long working time, enhanced low temp capability.
HIPEC Q3-6646 Semiconductor Protective Coating is a high purity, two-part, solventless silicone gel designed for the protection of semiconductor junction surfaces that have higher levels of integration.
It is chemically compatible with most device surfaces, provides physical and environmental protection of the chip and inter-connecting wires and provides stress relief for delicate device leads and the die.
Other secondary features include protection against contamination of the junction surface, obstruction of alpha particle penetration and stabilization of device characteristics. |
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One or two part: 2
Color: Clear
Viscosity/Flowability (poise): 6.8
Specific Gravity: 0.97
Working Time RT: >16 hrs
Heat Cure Time: 2 hrs/150'C |
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