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Hipec Q1-4939
2-part clear heat cure, cures to elastomer or gel depending on mix ratio, good flowability.
HIPEC Q1- 4939 Semiconductor Protective Coating is a high purity, two-part, solventless silicone designed for the protection of semiconductor junction surfaces that have higher levels of integration.
It is chemically compatible with most device surfaces, provides physical protection of the chip and inter-connecting wires, and provides stress relief for delicate device leads and the die.
Other secondary features include protection against contamination of the junction surface, shielding against alpha particle penetration and stabilization of device characteristics.
The product can be cured to a soft gel or a compliant elastomer by varying the mix ratio used ?see "Mixing" in "How to Use" section.
One or two part: 2
Color: Clear
Viscosity/Flowability (poise): 50
Specific Gravity: 1.03
Working Time RT: >168 hrs
Heat Cure Time: 2 hrs/150'C
Industrial field others
Dow Corning Corp/Corporate Headquarters
Phone 517-496-5369; 800-248-2481
Fax 517-496-4688
Homepage -
E-mail
Address 3100 James Savage Rd., PO.Box 994, Midland, MI 48686-0994
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