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| Dow Corning DA6501 |
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1-part translucent heat cure, flowable, long working time.
HIPEC SDA (Silicone Die Attach) 6501 Adhesive is a one-part, electrically insulating silicone die attach adhesive.
It is supplied as a solventless material and is specially processed to provide low volatility and low ionic impurities.
HIPEC SDA 6501 Adhesive quickly heat cures to an elastomeric adhesive, yet has a long working time (24 hours at 35'C).
HIPEC SDA 6501 Adhesive is extremely effective in relieving stress caused by the CTE (coefficient of thermal expansion) mismatch between the silicon die and the lead frame.
This can lead to significant reductions in stress-induced cracking or bending of the die after cure with minimal effects on wire bond strength and adhesion of the molding compound to the lead frame. |
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One or two part: 1
Color: Translucent
Viscosity/Flowability (cps or mPa-sec): 7,500
Durometer: 26 A
Specific Gravity: 1.0
Working Time RT: >24 hrs
Heat Cure Time: <5 min/150'C
Young's Modulus (M Pa): 0.5
Unprimed Adhesion Lap Shear (psi): 75 |
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