 |
 |
|
|
|
| BYK W 903 |
 |
| Solution of a copolymer with filler affinic groups |
 |
BYK W 903 is especially developed for Printed Circuit Board base materials.
It facilitates the incorporation of filler in the resin mix and stabilizes the filler(s) dispersion after the mixing procedure. |
 |
Density at 20'C: 1.6 g/ml
Flash point: 47 ¡ÆC
Non-volatile matter 10 minutes 150'C: 40 %
Appearance: clear to light yellow
Solvent: Methoxypropylacetate |
|
|
|
 |
|
|
|
|
|
 |
| There are no existing companies to distribute selected chemical product |
|
 |
|
|
|
