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BYK UV 3510
Polyether modified polydimethylsiloxane
Surface additive for radiation curing systems.
In non-aqueous systems BYK UV 3510 improves substrate wetting and tape release as well as leveling, and increases surface slip.
Density at 20'C in g/ml : 1.03
Non-volatile matter in % : >97
Flash point in 'C : >85
Industrial field others
BYK-Chemie USA
Phone (203) 265-2086
Fax (203) 284-9158
Homepage www.byk-chemie.com
E-mail info@byk.com
Address 524 South Cherry Street P. O. Box 5670 Wallingford, Connecticut 06492-7651
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