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BYK-LP S 6665
Wax dispersion
BYK-LP S 6665 is used in open mould applications such as spray up-, hand lay up-, filament winding, casting and others.
It prevents the air inhibition on the resin surface by optimum film building properties and so achieves a tack free resin surface.
Because of its properties in a wide temperature range of 10 - 50 'C it can be used during the whole year.
Density at 40'C in g/ml : 0.76
Flash point in 'C : 28
Non-volatile matter in% : 10
Apperance : white paste
Industrial field others
BYK-Chemie USA
Phone (203) 265-2086
Fax (203) 284-9158
Homepage www.byk-chemie.com
E-mail info@byk.com
Address 524 South Cherry Street P. O. Box 5670 Wallingford, Connecticut 06492-7651
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