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| Omicure 33DDS |
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OMICURE 33DDS is a newly developed version of 3,3' Diamino Diphenyl Sulfone. High purity 33DDS is produced in a unique proprietary process using readily available raw materials. These raw materials are halogen free so the ionic levels of OMICURE 33DDS are significantly lower than 3,3' Diamino Diphenyl Sulfone recovered as a reaction by-product.
As an epoxy curing agent OMICURE 33DDS is an effective, safer to use replacement for Methylene Dianiline (MDA). Due to its asymmetric structure, 33DDS can yield cured systems with higher compressive strength, less brittleness and higher heat deflection temperatures than MDA. Unlike 4,4' DDS, OMICURE 33DDS can cure at rates comparable to MDA. In polyimid production OMICURE 33DDS exhibits good reactivity. Polyimides produced using 33DDS exhibit higher temperature performance.
* APPLICATIONS
- Prepregs/Composites
- Castings
- Chemical Resistant Coatings
- Polyimid Resins
- Electronic Adhesives
- High Temperature Electrical Varnishes
- Polyurethane Crosslinking Accelerator |
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Form : Tan, free flowing, powder
Melting Point, 'C : 160 - 172
Assay, min. % : 97
Moisture Content, max % : 0.15
Particle size, microns : 5 - 10
Bulk Density: 33DDS, lbs./gal. : 4.7 - 5.0 , 33DDS, Ground, lbs./gal. : 3.6 - 4.2 , 33DDS, Fine, lbs./gal. : 2.0 - 2.5 |
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