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| Omicure DDA SERIES |
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| 461-58-5 |
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OMICURE DDA is Dicyandiamide, a solid latent curing agent for epoxy resins. It is offered in everal grades depending on the desired particle size. OMICURE DDA products are dispersed into resin systems where they remain stable until activated by heat. Uncatalyzed, dicyandiamide has an activation temperature of about 350¡ÆF and a formulated storage stability of over six months. When catalyzed with other latent accelerators like the OMICURE U series of substituted ureas, one component adhesive and sealant formulas can be prepared with cure temperatures of 225-250'F and excellent stability.
Epoxy systems cured with OMICURE DDA are characterized by outstanding adhesion making them the preferred choice for adhesive formulations. They are compatible with all epoxy resins, including Bisphenol A and F epoxies and epoxy novolacs. They can be used with diluted or undiluted resins and are compatible with a wide variety of fillers and pigments. OMICURE DDA is safe to handle and is considered non-toxic.
* APPLICATIONS
- One Component Adhesives
- Powder Epoxy Coatings
- Prepregs and Film Adhesives
- Electronic Potting and Encapsulting Compounds |
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Appearance : White crystalline powder
Assay, % min. : 99
Melting Point ('C) : 209
Ash Content, max % (unmicronized) : 0.01
Melamine Content, max % : 0.1
Moisture Content (loss @ 105'C) max % : 0.15
Silica content as anti-caking aid,% (micronized grades) : 0.5-2 |
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