 |
 |
|
|
|
| EPI-REZ 3540-WY-55 |
 |
EPI-REZ 3540-WY-55 Resin is a 55 percent solids dispersion of an EPON Resin 1007F in water and 2-propoxyethanol.
This resin is designed for use in formulating industrial baking finishes, film adhesives/primers and fiber finishes/binders.
When crosslinked with an appropriate resole, melamine or urea-formaldehyde resin and baked, epoxy coatings can be obtained that offer performance comparing favorably to solvent-borne epoxy coatings.
This resin may also be used in industrial ambient cure primers in conjunction with water-borne EPI-CURE amine curing agents that offer quick coalescing films with short lacquer dry times.
-Clear bake coil coatings
-Pigmented bak and ambient cure industrial coatings
-Modified for other waterborne resins to improve hardness, mar resistance and flexibility |
 |
Viscosity at 25'C, cP: 7,000-17,000
Nonvolatile materials, %wt: 53.5-55.5
Pounds/Gallon Solution: 9.0 Solids, calculated: 10.1
Appearance: Opaque white liquid
Solvent: 76% Water 24% 2-Propoxyethanol
Weight per Epoxide (WPE), g/equivalent: 1,600-2,000
pH: 7-10 |
|
|
|
 |
|
|
|
|
|
 |
| There are no existing companies to distribute selected chemical product |
|
 |
|
|
|
