  | 
							
								
								
	
	
		  | 
		
			 
			 
		 | 
	 
	 |  
	 |  
	
		
		
		
			
			
				| EPI-REZ Resin 3535-WY-50 |  
				
				
				
				
				
				
				
				
				
				
				
				  |  
				EPI-REZ Resin 3535-WY-50 is a 50% solids dispersion of EPON Resin 1004F in water and 2-propoxyethanol.  This resin is designed for use in formulating industrial baking finishes, film adhesives/primers and fiber finishes/binders.  When crosslinked with an appropriate resole (melamine or urea-formaldehyde resin) and baked, epoxy coatings can be obtained that offer performance comparing favorably to solvent-borne epoxy coatings.  This resin may also be used in industrial 2K ambient cure primers in conjunction with waterborne amine EPI-CURE Curing Agents that offer quick coalescing films with short lacquer dry times. -Clear bake coil coatings -Pigmented bake and ambient cure industrial coatings -Modifier for other waterbone resins to shorten the lacquer dry times |  
				
				
				
				
				
				
				
				  |  
				Viscosity @ 25'C, cP: 2,500 Density, lb/gal: 9.0 VOC, % wt.: 10.0 Weight per epoxide (WPE), g/equivalent: 1,050 Non-volatile materials, % wt.: 50.0 Appearance: Opaque White Liquid |  
				
				
				
					| 
						
					 | 
				 
				
			 
			
		 | 
		
		
		
			
				
				
				  |  
				
					| 
						
							
					 | 
				 
				 |  
				
				
				
					| 
						
					 | 
				 
				
					
						
							  |  
							
								
									
									
									
										| There are no existing companies to distribute selected chemical product |  
									
									 
									
								 | 
							 
							  |  
						 	
					 | 
				 
			 
			
			
		 | 
	 
 
									
								 |