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| EPON Resin 1214-B-77 |
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| Epoxy resin |
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| epoxy resin |
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EPON Resin 1214-B-77 is a one-pack, dicy-free brominated epoxy resin and curing agent solution supplied as 77% by weight solids in methyl ethyl ketone (MEK).
This resin system was developed to meet the increasing demands of FR-4 printed circuit board applications and to provide laminates with a nominal glass transition temperature (Tg) of 145'C.
Relative to conventional FR-4 epoxy resins, EPON Resin 1214-B-77 provides laminates with:
-Higher Tg
-Lower Z-axis coefficient of thermal expansion (CTE)
-Improved thermal stability
-Improved moisture resistance
-Improved solder resistance
-Increased optical density for UV blocking
-Fluorescence for automated optical inspection (AOI)
EPON Resin 1214-B-77 also offers an alternative for prepreg manufacturers seeking a replacement for conventional dicyandiamide cured resins. Whereas dicy-cured resins require the use of dimethylformamide (DMF), methyl OXITOL (MeOX), or similar solvents for dicy dissolution, EPON Resin 1214-B-77 can typically be processed with ketone solvents and with lower solvent levels. These features contribute to increased formulating flexibility and reduced health and safety concerns.
Moreover, the use of DMF with EPON Resin 1214-B-77 should be avoided as it can adversely affect the cure of the resin system.
Furthermore, EPON Resin 1214-B-77 provides prepreg manufacturers with opportunities for improved processing.
Because this resin is supplied as a one-pack resin and curing agent system, varnish preparation is greatly simplified as only the addition of appropriate amounts of accelerator and solvent are necessary.
Prepreg preparation is also enhanced as the higher volatility solvents typically used with EPON Resin 1214-B-77 can enable faster solvent removal from the prepreg and, thus, faster treater speeds for increased productivity.
For prepreg manufacturers, the benefits provided by EPON Resin 1214-B-77 can be summarized as:
-Elimination of certain hazardous solvents used for dicy dissolution
-Processing with ketone solvents
-Processing with lower solvent levels
-Increased formulating flexibility
-Reduced health and safety concerns
-Simplified varnish preparation
-Potential for increased treater productivity
EPON Resin 1214-B-77 may also be blended with other one-pack, dicy-free resins, such as Epoxy Research Resin RSM-2823 and Epoxy Research Resin RSM-2646, to tailor laminate properties as needed for specific applications.
For example, when blended with RSM-2646, glass transition temperatures ranging from 145 to 220'C can be obtained. |
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Epoxide equivalent wt (EEW), g/eq: 360-400
Resin solids, wt %: 77
Color, Gardner scale: 12
Bromine content, wt %: 18
Solution viscosity @ 25'C, poise: 2.2-4.0
Density @ 25'C, lb/gal: 10.2
Appearance: Dark yellow viscous liquid |
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