|
|
|
|
|
HICHEM-ADH |
|
Adipic dihydrazide |
|
1071-93-8 |
|
Curing agent in one pack-epoxy, heat curable resin suitable for encapsulating electronic components. Epoxy and Vinyl ester cured with HICHEM ADH have higher heat and alkali resistance. Solvent free, aqueous printing ink compositions consisting of acrylicpolyurethanes, cured with HICHEM ADH have good alkali and weather resistance. Quenching agent for formaldehyde in decorative coatings, floor construction materials and wooden boards/veneers. It reduces emission of free-unreacted formaldehyde and hence bad smell. |
|
PHYSICAL STATE: slightly yellow crystalline powder MELTING POINT: 180 - 182 C SOLUBILITY IN WATER 50 g/l AUTOIGNITION 360 C PH 9.5 ((at 10g/l, 20 C) |
Industrial field |
additive, plastic, polymer, resin, monomer |
|
|
|
|
|
|
|
There are no existing companies to distribute selected chemical product |
|
|
|
|
|