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| RAM-PART 200 |
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Designed for use with metal molds and epoxy or polyester resin systems.
RAM-PART releases produce a microthin coating on the mold surface.
Minimum transfer to molded parts.
A semipermanent release, providing multiple cycles of clean parting action on a seasoned mold.
RAM-PART releases withstand high temperatures.
Surface has a very low wettability and high surface tension to prevent sticking and part hang-up.
Will not interfere with painting or bonding.
Allows cost saving per molded part: provides a srtooth, uniform mold surface, touble-free production, fewer rejects and lower resin loss.
Higher temperatures often produce better and faster cure: RAM-PART mold releases enable molding at these higher temperatures (850-900) |
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Weight per Gallon/lbs.: 6.3
Flash Point, Seta-Flash, Closed CUD: 22F |
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| There are no existing companies to distribute selected chemical product |
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