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DCU-O
Copper
Copper Nanoparticles in Toluene Solvent
7440-50-8
PCB electrode seed layer
PCB pattern repairing materials
Size Distribution : 30~100
D50(nm,PSA) : 47.34
Metal Contents(wt%) : On Demand
Solvent : Toluene etc(Non-Polar Solvents)
Resistivity(µ
¥Ø¡¤§¯) : <12.0
Curing Method : Photonic Sintering
Substrate : Plastic Films
Industrial field others, inorganic chemicals, solvents, additive, biocide, fungicide, cosmetics
DNF Advanced Materials Co., LTD.
Phone +82-42-719-7937
Fax +82-42-367-7037
Homepage -
E-mail jhchoi@dnfam.kr
Address 190 Daejeon-ro 1331beon-gil, Daedeok-gu, Daejeon, Korea
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