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| DCU-O |
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| Copper |
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| Copper Nanoparticles in Toluene Solvent |
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| 7440-50-8 |
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PCB electrode seed layer
PCB pattern repairing materials |
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Size Distribution : 30~100
D50(nm,PSA) : 47.34
Metal Contents(wt%) : On Demand
Solvent : Toluene etc(Non-Polar Solvents)
Resistivity(µ
¥Ø¡¤§¯) : <12.0
Curing Method : Photonic Sintering
Substrate : Plastic Films |
| Industrial field |
others, inorganic chemicals, solvents, additive, biocide, fungicide, cosmetics |
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| There are no existing companies to distribute selected chemical product |
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