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| Dynasolve 185 |
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This unique Product was developed to improve the performance of n-methyl pyrrolidone.
In addition to n-methyl pyrrolidone, Dynasolve 185 contains a proprietary blend of ingredients that facilitate polymer removal and prevent the redeposition of particles.
Dynasolve 185 is effective and biodegradable.
It does not contain phenol, chlorinated solvents, or strong acids and bases.
Dynasolve 185 will not attack most metals used in electronic components.
*Applications:
- Dynasolve 185 is excellent for chemical deflashing of most plastics including Epoxy B-type materials.
- It will disintegrate many epoxy-molded devices except those molded with Epoxy B.
- Dynasolve 185 will remove epoxies cured in several ways including UV-cured and amine-cured.
- This solvent will remove most cured inks.
- Dynasolve 185 is excellent for removal of positive photoresists and carbonized polymers.
- It is an effective solvent for removing molded epoxy residue from molds. |
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Physical Form: Light to medium Amber Liquid
Specific Gravity: 1.04
Boiling Point: 406'F
Flash Point: 199'F
pH: 9 |
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