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| Dynasolve 165 |
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| Methylene chloride |
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| Methylene Chloride |
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Dynasolve 165 is a powerful blend of solvents and organic chemicals that is designed to disintegrate cast epoxy systems.
It is particularly effective against room temperature cured epoxy resins and most elevated temperature cured resins.
Dynasolve 165 is nonflammable and may also be used for decomposing urethanes.
Dynasolve 165 will disintegrate most epoxy systems at room temperature, including amine-cured epoxies.
It will not attack transfer-molded or novolac epoxies, which are commonly used for encapsulation of integrated circuits.
Dynasolve 165 is not selective and will attack most thermoplastic materials, wire coatings, and many thermoset coatings and materials.
Dynasolve 165 is methylene chloride based.
For applications in which methylene chloride is not acceptable, Dynasolve 185, Uresolve Plus SG, Dynasolve 750, and Decap are recommended. |
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Physical Form: Clear to Light Amber Liquid
Specific Gravity: 1.29
Boiling Point: 104'F
pH: 2-3 |
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