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| Dow Corning 7920 |
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1-part black heat cure, syringe dispensable, DRAM grade.
Die attach adhesive for the BGA package or other microelectronic devices. |
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One or two part: 1
Color: Black
Viscosity/Flowability (cps or mPa-sec): 24,000
Durometer: 71 A
Specific Gravity: 1.2
Working Time RT: >24 hrs
Heat Cure Time: 30 min/150'C
Young's Modulus (M Pa): 5.5
Unprimed Adhesion Lap Shear (psi): 1000 |
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| There are no existing companies to distribute selected chemical product |
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