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Dow Corning 7920 |
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1-part black heat cure, syringe dispensable, DRAM grade. Die attach adhesive for the BGA package or other microelectronic devices. |
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One or two part: 1 Color: Black Viscosity/Flowability (cps or mPa-sec): 24,000 Durometer: 71 A Specific Gravity: 1.2 Working Time RT: >24 hrs Heat Cure Time: 30 min/150'C Young's Modulus (M Pa): 5.5 Unprimed Adhesion Lap Shear (psi): 1000 |
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