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				| Dow Corning 1-4174 Thermally Conductive Adhesive |  |  |  | 1-part gray heat cure, highly thermally conductive, low flow, same as 1-4173 with 7 mil spacer beads, self-priming. Bonding integrated circuit substrates: adhering lids and housings: base plate attach: heat sink attach.
 |  |  |  | Thermal Conductivity (watts/meter- degK): 1.90 One or two part: 1
 Heat Cure Time: 90 min @ 100'C
 Viscosity/Flowability (cps or mPa-sec): 58,000
 Durometer: 92 A
 Unprimed Adhesion Lap Shear (psi): 590
 Color: Gray
 Specific Gravity: 2.71
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